OPTIMIZATION OF THERMAL LAYOUT DESIGN OF ELECTRONIC EQUIPMENTS ON THE PRINTED CIRCUIT BOARD. Journal of Engineering, [S. l.], v. 12, n. 03, p. 757–775, 2006. DOI: 10.31026/j.eng.2006.03.24. Disponível em: https://joe.uobaghdad.edu.iq/index.php/main/article/view/2848.. Acesso em: 17 may. 2024.